TECNALIA, in collaboration with Fusion for Energy (F4E), has developed a nano-sintering bonding technology that enables reliable joining of copper and other metals using a silver nanoparticle-based foil. This method allows metallic bonding at temperatures below 300 °C, avoiding melting and reducing thermal stress.

Originally designed for high-temperature fusion components, the technology produces void-free, conductive, and mechanically strong joints, and is adaptable to other metal systems via surface coatings. It is suitable for electronics, energy systems, power modules, heat sinks, and repair operations requiring thermal stability up to 960 °C.

• Low-temperature bonding with high thermal/electrical conductivity
• Dense, void-free metallic joints with strong mechanical properties
• Adaptable to various metals and scalable for industrial use
• Suitable for fusion, power electronics, energy storage, and thermal shielding